Optica pro Laser Processing

Laser Processing for Materies fragilis

Laser Micro-Processus ad OLED & PI dromonem

Laser micro-processing Est secans processus in parvis et minimis dimensionibus, praesertim in OLED (Organic-LED) et PI (Polyimide) incisis.

Laser Processing for Photovoltaic Industry

Laser Processing for Power Batteries

  • Laser secans in aurem poli
    • F-Theta Scan Lentes
      • TSL-1064-70-163Q-D14
      • TSL-1064-60-160Q-D14
      • TSL-1064-52-120Q-D14
      • TSL-1064-35-110Q-D14
  • Laser Purgatio in Foil
    • F-Theta Scan Lentes
      • TSL-1064-85-167Q-D20
      • SL-1064-215-340Q-D15
      • SL-1064-175-254Q-D10
      • SL-1064-170-255Q-D20
  • Laser Welding in Power Batteries
    • F-Theta Scan Lentes
      • SL-1064-120-254Q-D30-WC
      • SL-1064-180-348Q-D30-WC
      • SL-1064-180-400Q-D30-WC
      • SL-1064-250-500Q-D30-WC
    • Laser Collimators
      • COL-1064-D30-F75Q-0.12-WC-V2
      • COL-1064-D30-F100-0.1-WC-V2
      • COL-1064-D30-F125-0.1-WC-V2
      • COL-1064-D46-F150Q-0.1-WC-V2
      • COL-1064-D40-F120-0.125-WC-HP3
      • COL-1064-D40-F140-0.11-WC-HP3

Contact Us

Contact Form
LWOP, 27-30 June | Hall: B1 Booth: 422
Laser Korea, 5-7 | Booth: 4G34
LWOP India, 13-15 Septembris | Aula: 3 Booth: LF15
DSEI extensio, 12-15 Septembris | Booth: Vestibulum Pod 7
Commercial Sensu SPIE defensionis +, 2 - 4 May | Booth: 1320
Laser World of Photos, 27-30 June | Hall: B1 Booth: 422
Laser Mundus Photonics Indiae, 13-15 Septembris | Aula: 3 Booth: LF15
DSEI extensio, 12-15 Septembris | Booth: Vestibulum Pod 7